The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 01, 1992
Filed:
Jul. 15, 1991
Richard C Chu, Poughkeepsie, NY (US);
Michael J Ellsworth, Jr, Poughkeepsie, NY (US);
David T Vader, New Paltz, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
An impingement cooled compliant heat sink (CHS) is employed to extract heat from an array of computer chips in an electric module. A variety of embodiments and variations are provided. The most basic implementation is a metal sheet that is brought into contact with chips on a multi-chip module, and acts as a spreader plate for jet impingement immersion cooling with fluorocarbon, liquid nitrogen, or other dielectric liquids. This can increase cooling at a given flow rate by increasing the area for heat transfer. Slots and/or holes in teh sheet located between the chip sites serve to: (1) create flexible joints in the sheet between the chips to permit conformity to neighboring chip sites, (2) allow for clearance of decoupling capacitors and other structures on the substrate between the chips, and (3) permit the dielectric coolant to flow through the plate so that there will be no pressure difference across the CHS. The absence of pressure difference across the CHS is designed to render this cooling scheme relatively insensitive to pressure variations in the module.