The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 24, 1992
Filed:
Jan. 31, 1991
Applicant:
Inventors:
James W Liporace, Wallkill, NY (US);
James A Seirmarco, Buchanan, NY (US);
Assignee:
International Business Machines Corporation, Armonk, NY (US);
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H02N / ;
U.S. Cl.
CPC ...
361233 ; 269-8 ; 269903 ; 279128 ; 361232 ;
Abstract
An electrostatic chuck includes a body of refractory metal, preferably molybdenum, sized to support a semiconductor wafer. A first layer of diamond having a thickness in the range of 0.1-5.0 microns coats the refractory metal body. A pair of generally planar electrodes, preferably formed by molybdenum, are disposed on the first layer of diamond. A second layer of diamond, of like thickness as the first layer, conformally coats the pair of electrodes. A dc voltage applied across the pair of electrodes develops an electrostatic force to hold the wafer against the second diamond layer.