The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 17, 1992

Filed:

Sep. 24, 1991
Applicant:
Inventors:

Arnold Blum, Gechingen, DE;

Frank Gerth, Tubingen, DE;

Manfred Perske, Sindelfingen, DE;

Manfred Schmidt, Schonaich, DE;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
257778 ; 361400 ; 257697 ; 257772 ;
Abstract

A system for mounting VLSI devices on a substrate is disclosed, offering a high contact density. Each package consists of a semiconductor device having protruding elongated contact pin (2) on its surface and a wiring substrate having a cavity (3) on its surface. The cavities are filed with a conductive material (7) of a low melting point composition and sealed with a thin non-conductive foil (4). During packaging, the contact pins are made to penetrate the foil, and extend into the conductive alloy, thus making electrical contact therewith. To ease the penetration of the foil, the contact pins could be set into oscillating motion by means of an ultrasonic generator.


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