The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 17, 1992
Filed:
Jun. 12, 1990
Applicant:
Inventors:
Philip J Spletter, Cedar Park, TX (US);
Claire T Galanakis, Austin, TX (US);
William G Flynn, Oakland, CA (US);
Assignee:
Microelectronics and Computer Technology Corp., Austin, TX (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K / ;
U.S. Cl.
CPC ...
21912163 ;
Abstract
A method for reflowing solder without flux includes the steps of placing a first metallic element in contact with a second, solder-plated element, thereby defining a bond site; and causing a laser beam to impinge on the bond site. An apparatus for performing the above method is also disclosed.
Spletter, Philip. (1992). Method and apparatus for fluxless solder reflow (U.S. Patent No. 5164566). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5164566
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile