The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 17, 1992

Filed:

Sep. 06, 1990
Applicant:
Inventors:

Yasuhide Ohno, Kawasaki, JP;

Tadakatsu Maruyama, Kawasaki, JP;

Hiroaki Otsuka, Kawasaki, JP;

Hiroyuki Tanahashi, Kawasaki, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
437220 ; 437206 ; 437182 ; 437183 ; 2281802 ;
Abstract

A method of connecting a TAB tape to a semiconductor chip is disclosed which comprises the steps of preliminarily locating and fixing bumps at positions corresponding to a pattern of electrodes of the semiconductor chip to be connected; and bonding the bumps by thermocompression to the electrodes of the semiconductor chip and the leads of the TAB tape, respectively, so that each electrode of the semiconductor chip is electrically connected to the corresponding lead of the TAB tape through a corresponding one of the bumps. Also disclosed are a bump sheet and a bumped tape to be used in a method of connecting a TAB tape to a semiconductor chip.


Find Patent Forward Citations

Loading…