The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 17, 1992
Filed:
Jun. 11, 1991
Kabushiki Kaisha Toshiba, Kawasaki, JP;
Abstract
The present invention discloses a semiconductor manufacturing apparatus comprising a wafer supply unit including a tray on which a plurality of wafers are placed, a positioning unit for detecting specific points on the wafers prior to molding of a resin and compensating for the position of the wafers, a molding unit for molding the resin on the peripheries of the wafers which have been compensated for position, an injecting unit for supplying the resin to the molding unit, a storage unit for storing resin-molded wafers, a wafer carrying unit for carrying wafers between the supply unit and the positioning unit, between the positioning unit and the molding unit and between the molding unit and the storage unit, and a control unit for controlling the operation of the supply unit, the positioning unit, the molding unit, the injecting unit, the storage unit and the carrying unit.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile