The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 17, 1992
Filed:
Sep. 25, 1990
Randall W Nichols, West Lake, OH (US);
James C Davis, Hudson, OH (US);
Robert D Littler, Cashmere, AU;
The Standard Oil Company, Cleveland, OH (US);
Abstract
A multi port apparatus (220,440) provides for the treatment of material. Such apparatus comprises at least one wafer (240,320,410), each wafer comprising a central area (246,325,416) providing a plurality of members (18,303,309,360) arranged in a plurality of layers (262,306,308,432) first peripheral support means (241,321,411) encompassing the central area and having upper and lower surfaces (244,245,324,414,415); second peripheral support means (248,326,418), having upper and lower surfaces (251,252,330,421,422) and carried radially outwardly from the first peripheral support means; and a plurality of separate bore fluid chambers (253-256, 335-338, 423-426) defined between the first and second peripheral support means and communicable with the central area; vessel means (228,448) providing a first port (221,441) a second port (222,442) and a plurality of separate bore fluid port means (223-226, 443-446) communicating with the four separate bore fluid chambers; and means for compressing (234,454) at least one wafer within the apparatus. The present invention also provides three and four port apparatus (60,180). Multi-chambered wafers (240,320,410) are provided as well as wafers (200,280,300,350 and 460) for use in the multi port apparatus. Finally, methods for the manufacture of wafers are provided.