The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 10, 1992
Filed:
Mar. 19, 1990
Matsushita Electric Industrial Co., Ltd., Osaka, JP;
Abstract
A high-density circuit module has a box shaped shielding case made from a plate blank which is bent to provide the shield case. A printed wiring board is placed on the bottom surface portion of the shielding case, and a plurality of electronic components are soldered to conductor lands of the printed wiring board. A plurality of externally connected leads are soldered to connection lands of the printed wiring board. A process for producing the high-density circuit module includes the steps of placing the printed wiring board on the blank, then soldering the electronic components and leads to the printed wiring board and then bending the blank to provide the shielding case. The plurality of externally connected leads are formed from a plurality of leads which are originally integrally connected to the bottom surface portion of the shielding case, by separating the plurality of leads form the bottom surface portion of the shielding case. A high-density circuit module having a small number of parts and a simple structure is easily manufactured.