The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 10, 1992
Filed:
Aug. 27, 1991
Applicant:
Inventor:
Suguru Tsuji, Tokyo, JP;
Assignee:
Nippon Zeon Co., Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C09J / ; C09J / ; B32B / ;
U.S. Cl.
CPC ...
525113 ; 528 91 ; 528103 ; 528110 ; 528112 ; 528113 ; 528120 ; 528121 ; 528123 ; 528124 ; 528393 ; 525117 ; 525118 ; 525119 ; 525120 ; 525121 ; 525122 ; 525502 ; 523400 ; 428901 ;
Abstract
In an adhesive for printed circuit boards, whose main components are an epoxy resin and a polymer rubber, the improvement wherein the polymer rubber is a hydrogenated conjugated diene polymer rubber having not more than 100 ppm of metal content, not more than 100 ppm of ion content as determined by ion chromatography, and an iodine value of not more than 120, the ratio by weight of the hydrogenated conjugated diene polymer rubber to the epoxy resin in the adhesive being 35-75 weight % to 65-25 weight %.