The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 10, 1992

Filed:

Mar. 12, 1990
Applicant:
Inventors:

Hiroshi Hayashi, Kyoto, JP;

Yuichi Fujii, Kyoto, JP;

Motoyuki Suzuki, Kyoto, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L / ; C08L / ;
U.S. Cl.
CPC ...
525109 ; 525489 ; 525524 ; 523427 ;
Abstract

A resin composition, comprisng a glycidyl ether of a hydrogenated conjugated diene polymer, an epoxy resin, and a reaction product of a phenolic compound with formaldehyde, having improved flexibility and thermal stability and useful for sealing a semiconductor device, whereby thermal stress can be effectively reduced.


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