The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 10, 1992
Filed:
Jul. 18, 1991
Norman J Roth, Kokomo, IN (US);
Delco Electronics Corporation, Kokomo, IN (US);
Abstract
A method of making an electrical interconnection is provided for electrically and physically connecting a plurality of bonding sites on an integrated circuit chip to a plurality of external electrical connections. This electrical interconnection method uses a plurality of individual electrical leads which have been formed so as to have the same degree of non-perpendicularity with respect to the rectangular shape of the integrated circuit. All of the individual leads are angled so as to rotate in the same direction around the integrated circuit. This angled lead design provides enhanced strain relief and improved performance during use since the integrated circuit is free to rotate under an applied stress, while efficiently maximizing the number of available electrical leads for bonding to the integrated circuit chip. In addition, this electrical interconnection method is suitable for use with tape automated bonding methods.