The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 10, 1992
Filed:
Oct. 15, 1991
Glenn J Gulbranson, Burnsville, MN (US);
Steven J Young, Excelsior, MN (US);
Gerald W Kenealey, Minneapolis, MN (US);
Ceridian Corporation, Minneapolis, MN (US);
Abstract
Circuit apparatus comprises an integral structure of first and second multilayer wiring board portions and a flexible circuit portion. The wiring board portions each have at least circuit trace planes, ground planes and insulator planes. The flexible circuit portion includes at least one signal trace plane and at least one ground plane separated by at least one insulator plane; the singal trace plane of the flexible circuit portion being integral with a signal trace plane of each of the wiring board portions, the ground plane of the flexible circuit portion being integral with a ground plane of each of the wiring board portions, and the insulator plane of the flexible circuit portion being integral with an insulator plane of each of the wiring board portions. Selected ones of a plurality of electric contacts are connected to selected ones of the circuit traces of the circuit trace plane of the flexible circuit portions; others of the contacts being connected to the ground plane. A pin connector is conencted to the plurality of contacts and is arranged to electrically connect selected circuits traces and the ground plane of the flexible circuit portion to an interconnect backpanel, thereby electrically connecting the wiring board portions to the backpanel with minimum inductance.