The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 03, 1992
Filed:
Jan. 11, 1991
Hidenobu Misawa, Nagoya, JP;
NGK Insulators, Ltd., , JP;
Abstract
A method and apparatus for shaping ceramic multi-layer structural bodies by extruding through a die. Ceramic molding compounds having different properties are fed under pressure, united and integrated in an extruding apparatus, while thicknesses of layers of the respective ceramic molding compounds are controlled by adjusting extruding pressures of the respective ceramic molding compounds. The extruding apparatus includes a die having a tip end opening of a given shape corresponding to the structural bodies to be extruded, a first extruding means capable of feeding a ceramic molding compound to the die under a given pressure, and a second extruding means for feeding another ceramic molding compound to the die. The another ceramic molding compound is different from that to be extruded through the first extruding means. The second extruding means is provided separately from the first extruding means.