System and method for manufacturing copper clad glass epoxy laminates

Abstract

A system of conveyors and handlers for manufacturing copper clad laminates is disclosed. The system has a layup station including at least two clean rooms in which B-stage and copper foil sheets are respectively placed. A sandwich comprising a copper foil sheet placed into contact with a press plate is conveyed from the first to the second clean room where a B-stage sheet is positioned against the copper foil. The resulting uncured laminate is then transferred with its press plate to a stacking station until a predetermined number of laminates, separated by press plates, is stacked into a 'book'. One or more books are then conveyed through press loading equipment where heat and pressure are applied to cure the laminates. The books are then transferred to a breakdown station where the cured laminates and press plates are successively and sequentially stripped from the book. The press plates are conveyed back to the layup station for recycling into 'new' books with each press plate cleaned immediately prior to reentering the first clean room. To minimize the migration of B-stage dust or fibers from the second to the first clean room, the ambient atmospheric air pressure within the first clean room is maintained at a greater pressure than the air pressure within the second clean room.