The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 03, 1992

Filed:

Dec. 05, 1990
Applicant:
Inventor:

Takushi Motoyama, Kawasaki, JP;

Assignee:

Fujitsu Limited, Kawasaki, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B44C / ; C03C / ; C03C / ; B29C / ;
U.S. Cl.
CPC ...
156643 ; 156651 ; 156653 ; 156657 ; 1566611 ; 156663 ; 156668 ; 430329 ;
Abstract

A method for removing a patterned multilevel resist formed on a substrate where layer of a substrate, the multilevel resist has a lower resist layer and an upper resist layer formed on the lower resist layer, and where the upper resist layer contains silicon atoms. The method includes forming a resin layer on the lower resist layer and on a surface exposed from the patterned multilevel resist, and etching the resin layer and the patterned multilevel resist by a first dry etching process using halogen containing gas until the upper resist layer is removed. The resin layer and the multilevel resist, which have remained after the first dry etching process, are etched by a second dry etching process using oxygen containing gas.


Find Patent Forward Citations

Motoyama, Takushi. (1992). Method of removing a patterned multilevel resist from a surface layer on (U.S. Patent No. 5160404). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5160404

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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