The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 20, 1992

Filed:

Mar. 09, 1989
Applicant:
Inventors:

Masahiro Ohta, Yokohama, JP;

Saburo Kawashima, Yokosuka, JP;

Katsuaki Iiyama, Odawara, JP;

Shoji Tamai, Yokohama, JP;

Hideaki Oikawa, Yokohama, JP;

Akihiro Yamaguchi, Kamakura, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L / ; C08L / ; C08G / ;
U.S. Cl.
CPC ...
525432 ; 525420 ; 525436 ; 525537 ; 525906 ; 525928 ;
Abstract

This invention relates to molding resin compositions, and more particularly relates to polyimide resin compositions having markedly improved molding ability in addition to excellent high temperature stability, chemical resistance and mechanical strength. The polyimide resin compositions of this invention comprises 99.9 to 50.0% by weight of the polyimide and 0.1 to 50.0% by weight of polyphenylene sulfide and/or aromatic polysulfone and/or aromatic polyetherimide high-temperature engineering polymer. The polyimide consists essentially of recurring units of the following formula: ##STR1##


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Ohta, Masahiro. (1992). Polyimide resin composition (U.S. Patent No. 5157085). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5157085

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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