The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 20, 1992
Filed:
Aug. 03, 1990
Hideo Nomura, Yokohama City, JP;
Nobuyuki Yamaguchi, Yokohama City, JP;
Hidekazu Ishimura, Fuji City, JP;
Isao Takagi, Samejima, JP;
Nissan Motor Co., Ltd., Yokohama City, JP;
Asahi Kasei Kogyo Kabushiki Kaisha, Osaka, JP;
Abstract
In order to increase the performance of a mold of thermosetting resin, metal powder is dispersed in the resin mold which has a dense and voidless structure. The mold may be mounted on a back-up member of metal. In this case, the bonding between the mold and the back-up member is much assured when metal balls are contained in the mold near the back-up member. Furthermore, the mold may be electrically metal-plated. In this case, the mold is coated with a conductive plastic paint before being subjected to the electric metal plating in an electrolytic solution.