The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 20, 1992
Filed:
Jun. 11, 1991
Tha Do-Thoi, Rothenbach, DE;
Klaus Popp, Nurnberg, DE;
Hoechst CeramTec Aktiengesellschaft, Selb, DE;
Abstract
A solder coating is applied to a metallized ceramic part in that at least two layers, in each case composed of nickel, copper, silver, zinc or tin, are applied chemically or galvanically. Under the soldering conditions molten solder metal forms on these layers. Useful layers for hard solders are those which are in each case composed of Ni, Cu or Ag. For example, a layer of nickel, copper or silver, with a layer thickness of at least 0.5 .mu.m, can be first applied to the metallized ceramic part, followed by at least one further layer of nickel, copper or silver with a layer thickness of 10-105 .mu.m, until a total layer thickness of 15-300 .mu.m is obtained.