The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 13, 1992
Filed:
Apr. 26, 1991
Thiam B Lim, Singapore, SG;
Soon C Lian, Singapore, SG;
Texas Instruments Incorporated, Dallas, TX (US);
Abstract
The degree of wire sweep and wire clearance over the buss bars in the 16 Mega Bit LOC package is found to be dependent on the angle of the bond wires. A positive wire angle range of 5 to 15 degrees is recommended for minimum wire sweep and maximum wire clearance over the buss bars. This is so because they offer the least resistance to the flow of the mold compound during transfer molding. A staggered gating system ensures that the wire angles in all cavities are positive with respect to the gate. This invention is also applicable to conventional packages.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile