The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 13, 1992
Filed:
Apr. 02, 1992
Applicant:
Inventors:
Norimasa Honda, Osaka, JP;
Hirokazu Yukawa, Osaka, JP;
Assignee:
Daikin Industries, Ltd., Osaka, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C / ; B29C / ; B29C / ;
U.S. Cl.
CPC ...
264127 ; 264118 ; 521145 ; 521134 ; 521919 ;
Abstract
A molding process for preparing long and thick, large porous PTFE articles comprising preparation steps of a powder for molding which includes a step of gelation of PTFE powder; a pre-forming step by a ram-extrusion; a baking step of the pre-formed article under a non-constrained circumstance; and if necessary, a cooling step; said powder for molding being containing a binder which has a melting point of lower than that of PTFE and does not decompose at a baking temperature of PTFE.