The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 06, 1992
Filed:
Mar. 18, 1991
Frank J Juskey, Coral Springs, FL (US);
Lonnie L Bernardoni, Coral Springs, FL (US);
Thomas J Swirbel, Davie, FL (US);
Barry M Miles, Plantation, FL (US);
Motorola, Inc., Schaumburg, IL (US);
Abstract
A transfer molded pad array chip carrier is formed by mounting and wirebonding a semiconductor device (12) on a printed circuit board (10). The bottom side of the printed circuit board may have an array of solderable surfaces (24). A polymer coating (18) is applied over the semiconductor device (12), the wirebonds (16), and the top side of the printed circuit board (10) and cured. The coating (18) is then sputter etched in a partial vacuum to enhance the adhesion of the transfer molding compound (20) to the printed circuit board (10). The semiconductor device is encapsulated by a transfer molding process. The polymer coating (18) also provides a barrier to alpha particle emission, improves the moisture resistance of the completed package and reduces stress at the surface of the device.