The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 06, 1992
Filed:
Apr. 09, 1991
Applicant:
Inventors:
Toshie Tanaka, Ikeda, JP;
Akiro Nakagawa, Tokyo, JP;
Haruhiko Watari, Tokyo, JP;
Yasuhiko Ikeda, Toyonaka, JP;
Assignee:
Nifco, Inc., Yokohama, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B / ; F16M / ;
U.S. Cl.
CPC ...
428212 ; 428119 ; 428120 ; 428133 ; 428134 ; 428137 ; 428138 ; 428161 ; 428172 ; 264248 ; 2643288 ; 248188 ; 2481888 ; 248599 ; 248615 ; 248634 ; 248673 ; 248677 ; 248678 ; 5310 ; 108156 ;
Abstract
A double-shot molded resin article comprises a primary molding part and a secondary molding part. The secondary molding part is molded from a thermoplastic resin having a melting point higher than the melting point of the primary molding thermoplastic resin. The primary molding part has a plurality of raised portions formed upon its surface so as to be fusion bonded to the secondary molding part. These raised portions are fused by means of the secondary molten resin at the time of the secondary molding process, whereby the primary and secondary molding parts are fusion-bonded to each other.