The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 06, 1992
Filed:
Apr. 30, 1990
Dale W Dorinski, Coral Springs, FL (US);
Motorola, Inc., Schaumburg, IL (US);
Abstract
A manufacturing process for a multilayer thermoplastic printed circuit substrate (200) begins with a thermoplastic core substrate (202) having a printed circuit pattern (204) on a surface (202A) of the core substrate. Either fully reacted or partially reacted thermoplastic material is dissolved in a suitable dissolving agent and then applied in the liquid state over the surface (202A) of the core substrate. Application is by spraying, dipping, spinning or rolling. This results in a layer of liquid thermoplastic material covering the printed circuit pattern on the core substrate. The dissolving agent is then removed from the thermoplastic layer, leaving behind a uniform, dry hard, dielectric film of thermoplastic resin (206). Using photolithographic techniques, a via (206A) is opened up in the dielectric layer. If the starting material for the dielectric layer was partially reacted thermoplastic resin, the dielectric layer is now fully cured. A second printed circuit pattern (208) is then applied over the dielectric layer and into the via, thereby forming a conductive through-hole, which connects the two printed circuit patterns.