The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 29, 1992
Filed:
May. 07, 1991
Gabriel G Bakhit, Huntington Beach, CA (US);
Kevin P Shambrook, Laguna Beach, CA (US);
Hughes Aircraft Company, Los Angeles, CA (US);
Abstract
Interconnection of densely populated multiple chip integrated hybrid circuits (12) in a manner such that heat can be efficiently extracted therefrom. An integrated circuit die (31) is attached to a flip chip interconnect layer by soldering the connection pads thereto. The interconnect layer is slid off its substrate (11) in the manner of a decal. After the circuit has been tested and found acceptable, the other side of the die (31) is permanently bonded to a thermal conduction plate or heat sink (32). The decal interconnect (33) is made of alternating layers of an insulator (41) and a conductor (42) built on top of an erodible sacrifical layer (48) applied to a substrate. The sacrificial layer (48) is dissolved by a suitable solvent to float the multilayer interconnect off the substrate (11).