The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 29, 1992

Filed:

Aug. 01, 1990
Applicant:
Inventors:

Frank J Bottari, Acton, MA (US);

Jack Hanoka, Brookline, MA (US);

Frank W Sylva, North Billerica, MA (US);

Assignee:

Mobil Solar Energy Corporation, Billerica, MA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ; H01L / ;
U.S. Cl.
CPC ...
437187 ; 437-2 ; 437-8 ; 437180 ; 437245 ; 101150 ; 101163 ; 101170 ; 136256 ;
Abstract

A method of applying metallized contacts to the surfaces of semiconductor substrates using a conventional pad printing device. Standard screen printing inks diluted 2-30 weight percent with an appropriate solvent have been satisfactorily used to accomplish the method. For certain contact configurations, portions of the surface of the substrate are covered with a Mylar mask during the pad printing process. The method makes it possible to form a metallized contact having a uniform thickness on an uneven substrate surface, e.g., the surface of a silicon substrate produced by the EFG method.


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