The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 29, 1992
Filed:
Dec. 27, 1990
Applicant:
Inventors:
Assignee:
Kabushiki Kaisha Toshiba, Kawasaki, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C / ;
U.S. Cl.
CPC ...
425110 ; 264134 ; 26427217 ; 2643289 ; 425 90 ; 4251291 ; 425543 ; 425547 ;
Abstract
A resin molding apparatus for molding an insulating resin mold at the peripheral portion of a semiconductor wafer has an upper metallic mold, and a lower metallic mold which clamps the semiconductor wafer with the upper metallic mold. The upper and lower metallic molds form a resin space at the portion corresponding to the peripheral portion of the semiconductor wafer. The contact surfaces of the upper and lower metallic molds, which are in contact with the semiconductor wafer, and the inner surface of the resin space are coated with elastic material which does not adhere to the insulating resin.