The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 29, 1992
Filed:
Mar. 29, 1990
Makoto Ishihara, Ohtsu, JP;
Kazuhiro Kiminami, Kusatsu, JP;
Masakazu Wakabayashi, Shiga, JP;
Hirokazu Hori, Shiga, JP;
Saneharu Tatsu, Shiga, JP;
Sachio Takeshita, Shiga, JP;
Sekisui Kagaku Kogyo Kabushiki Kaisha, Osaka, JP;
Abstract
A method for the manufacture of thermoplastic resin sheets, including extruding molten thermoplastic resin at an extrusion velocity V through a slit provided in an extrusion mold so as to form thermoplastic resin sheets with embossed surfaces, wherein said thermoplastic resin is extruded from said slit in said extrusion mold under conditions such that the ratio V/H of said extrusion velocity V to the width H of said slit exceeds a critical value (V/H)c, said critical value (V/H)c being the ratio of the extrusion velocity to the width of the mold slit corresponding minimum value of the roughness of the embossment formed on the surface of said thermoplastic resin sheets, whereby defects such as the adhesion to and winding onto rollers, inferior appearance and sizing marks which are prone to occur when the sheets are embossed with embossing rollers.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile