The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 22, 1992

Filed:

Mar. 22, 1991
Applicant:
Inventors:

Ryuji Kitakado, Tenjinkitamachi, JP;

Hironobu Yano, Tenjinkitamachi, JP;

Hiroaki Kakuma, Tenjinkitamachi, JP;

Tetsuo Hoki, Tenjinkitamachi, JP;

Takao Kanai, Tenjinkitamachi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06K / ;
U.S. Cl.
CPC ...
382-8 ; 382 25 ; 358101 ; 358106 ; 358107 ; 364559 ;
Abstract

A printed circuit board (11) is provided with a conductive pattern (P, R) and a through hole (H) thereon. Respective images of the conductive pattern and a through hole are photoelectrically read with an image reader (20). The conductive pattern image is magnified in size to obtain a magnified pattern image (PI.sub.m), while the hole image is magnified at different magnification factors to obtain magnified hole images (HI.sub.n, HI.sub.n-i). A ring image (RP) is defined by the difference of the magnified hole images. The overlapped region (WR) on which the ring image and the magnified pattern image overlap each other is then calculated, and a defect or an opening of the conductive pattern is detected by calculating the aperture angle (.theta.) of the overlapped image.


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