The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 22, 1992
Filed:
Jul. 28, 1989
Tsutomu Okutomi, Yokohama, JP;
Atsushi Yamamoto, Fuchu, JP;
Seishi Chiba, Yokohama, JP;
Tsuneyo Seki, Fuchu, JP;
Mikio Okawa, Tama, JP;
Mitsutaka Honma, Tokorozawa, JP;
Kiyofumi Otobe, Hachioji, JP;
Yoshinari Satoh, Tokyo, JP;
Tadaaki Sekiguchi, Yokohama, JP;
Kabushiki Kaisha Toshiba, , JP;
Abstract
An Ag-Cu-WC contact forming material for a vacuum interrupter comprising a highly conductive component comprising Ag and Cu and an arc-proof component comprising WC wherein the content of the highly conductive component is such that the total amount of Ag and Cu(Ag+Cu) is from 25% to 65% by weight and the percentage of Ag based on the total amount of Ag and Cu[Ag/(Ag+Cu)] is from 40% to 80% by weight; wherein the content of the arc-proof component is from 35% to 75% by weight; wherein the structure of the highly conductive component comprises a matrix and a discontinuous phase, the discontinuous phase having a thickness or width of no more than 5 micrometers and wherein said arc-proof component comprises a discontinuous grain having a grain size of no more than 1 micrometer.