The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 15, 1992

Filed:

Feb. 25, 1991
Applicant:
Inventors:

Shunpei Yamazaki, Tokyo, JP;

Mitsunori Tsuchiya, Atsugi, JP;

Kazuo Urata, Atsugi, JP;

Itaru Koyama, Hatano, JP;

Shinji Imatou, Atsugi, JP;

Shigenori Hayashi, Atsugi, JP;

Naoki Hirose, Atsugi, JP;

Mari Sasaki, Atsugi, JP;

Noriya Ishida, Atsugi, JP;

Kouhei Wada, Atsugi, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
437215 ; 437219 ; 26427217 ; 427 41 ;
Abstract

An electronic device comprising a substrate having a frame, a metal lead and electronic parts in a bonding structure, and a molding of an organic resin formed on the substrate, wherein the surface of the organic resin is provided with a hardened water-resistant or carbonaceous film.


Find Patent Forward Citations

Yamazaki, Shunpei. (1992). Plasma processing method for improving a package of a semiconductor (U.S. Patent No. 5147822). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5147822

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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