The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 08, 1992
Filed:
Sep. 14, 1988
Applicant:
Inventors:
Takao Fukunaga, Hiratsuka, JP;
Hisao Nakajima, Hiratsuka, JP;
Kenzo Kobayashi, Ichihara, JP;
Masanao Kono, Kakogawa, JP;
Hisao Irie, Takasago, JP;
Ryo Inoue, Himeji, JP;
Assignees:
The Furukawa Electric Co., Ltd., Tokyo, JP;
Harima Chemicals, Inc., Kakogawa, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K / ;
U.S. Cl.
CPC ...
148 23 ; 148 24 ; 148 26 ; 252518 ; 252511 ;
Abstract
A solder precipitating composition comprises a powder of a metal having the highest ionization level among metals constituting a solder alloy to be prepared, and a salt between a carboxylic acid and a remaining metal of the solder alloy. The composition is applied to a surface on which the solder is to be precipitated, and the solder is precipitated, thereby performing soldering.