The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 01, 1992

Filed:

Apr. 10, 1990
Applicant:
Inventors:

Ludovicus Megens, Eindhoven, NL;

Petrus H Vriens, Eindhoven, NL;

George A Asselman, Eindhoven, NL;

Gerardus Notenboom, Eindhoven, NL;

Assignee:

U.S. Philips Corporation, New York, NY (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K / ; H05K / ;
U.S. Cl.
CPC ...
361400 ; 361417 ; 361419 ; 174260 ; 439 83 ; 439 84 ;
Abstract

A method of mounting SMD components (6, 7, 8) and wire components (21, 22) on a printed circuit board (2), in which the wire components (21, 22) ae secured on the printed circuit board (2) by means of connection elements (13, 14). The SMD components (6, 7, 8) and the connection elements (13, 14) are secured by reflow soldering on the printed circuit board (2), while the wire components (21, 22) are connected by their connection wires (19, 20) to the connection elements (13, 14) by welding.


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