The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 01, 1992
Filed:
Jun. 25, 1990
Applicant:
Inventor:
John W Curry, II, Austin, TX (US);
Assignee:
Microelectronics and Computer Technology Corporation, Austin, TX (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24B / ;
U.S. Cl.
CPC ...
5128 / ; 51317 ; 427142 ;
Abstract
A defective metallization layer is removed from the top of an electronic component such as an integrated circuit or a copper/polyimide substrate by polishing with a rotating pad and a slurry. Non-defective underlying metallization layers are preserved and a new metallization layer is fabricated to replace the defective layer.
Curry, II, John. (1992). Correcting a defective metallization layer on an electronic component by (U.S. Patent No. 5142828). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5142828
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile