The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 18, 1992

Filed:

Aug. 02, 1991
Applicant:
Inventors:

Gregory R Black, Vernon Hills, IL (US);

Alexander W Hietala, Cary, IL (US);

Darioush Agahi-Kesheh, Buffalo Grove, IL (US);

Assignee:

Motorola, Inc., Schaumburg, IL (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H03B / ; H03B / ; H03L / ;
U.S. Cl.
CPC ...
331 99 ; 3311 / ; 3311 / ; 3311 / ; 331186 ; 361400 ; 361406 ; 455 76 ; 455 87 ;
Abstract

A voltage controlled oscillator and buffer amplifier circuit (211) is disclosed. The circuit is in a stacked configuration, whereby, the current from the power supply (361) is used by the buffer amplifier circuit and reused by the VCO circuit. The VCO circuit includes two transistors (333, 325). The transistors are set-up in a mirrored configuration, so that one of the transistors (325) controls the bias current in the other transistor (333). Both of the transistors are integrated into a semiconductor circuit die (365), thus, matching the thermal characteristics of the transistors (333, 325) and improving control of the bias current. The die (365) is bonded to a ceramic substrate (601). The substrate (601) has connectivity paths for connecting components in the circuit die to components external to the circuit die. Some of the connectivity paths are made of a material and length to form passive circuit elements.


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