The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 18, 1992
Filed:
Oct. 25, 1990
Applicant:
Inventors:
Hisashi Watanabe, Kyoto, JP;
Yoshihiro Todokoro, Kyoto, JP;
Masazumi Hasegawa, Shinnanyo, JP;
Mitsutoshi Fukuda, Yamato, JP;
Assignees:
Matsushita Electronics Corporation, Kadoma, JP;
Tosoh Corporation, Shinnanyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G03C / ;
U.S. Cl.
CPC ...
430296 ; 430270 ; 430312 ; 430327 ; 430330 ; 430394 ; 430942 ; 2504923 ; 427384 ;
Abstract
A thin film of conductive high molecular compound is formed on a substrate such as Si followed by a heat treatment, and thereafter an electron beam exposure and subsequent development are made, to form pattern of the thin film of conductive high molecular compound; this method can eliminate forming of metal film to prevent the electron charge, can prevent charging of resist in electron-beam exposure or further prevent proximity effect when combined with deep ultraviolet light exposure.