The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 18, 1992

Filed:

Feb. 25, 1991
Applicant:
Inventors:

Shigeo Suda, Osato, JP;

Osamu Kodama, Kumagaya, JP;

Takumi Tanikawa, Tokoname, JP;

Hideyuki Munakata, Tokyo, JP;

Assignees:

Chichibu Cement Co., Ltd., Yokyo, JP;

Inax Corporation, Aichi, JP;

ILB Co., Ltd., Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C / ;
U.S. Cl.
CPC ...
156423 ; 156242 ; 156245 ; 156293 ; 156500 ; 264 69 ; 264 71 ; 264228 ; 264256 ; 425215 ; 425424 ; 425454 ;
Abstract

There is provided an apparatus for producing a paving block comprising a block substrate and a solid top layer selected from a tile-like layer and a cured cement mortar layer firmly bonded onto the upper surface of the block substrate. The apparatus comprises a mortar applicator (21) consisting essentially of a mortar container and a masking bottom board (23) having an opening (24) to be located on the back of a top layer (1-2) or the upper surface of a block substrate (1-1) during application of cement mortar thereon, a clamping plate (25) to be located on the top layer (1-2) placed on the block substrate (1-1) during bonding them, and a scraping frame (26) for scraping excess mortar remaining on the side surfaces of the bonded block. When the apparatus is used to produce a novel paving block comprising a block substrate and a solid top layer having a plane dimension smaller than the substrate, squeeze-out deposits (6) of the cement mortar (7) are further formed around the bonded top layer (1-2).


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