The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 04, 1992

Filed:

Apr. 18, 1990
Applicant:
Inventors:

Takashi Sakuda, Suwa, JP;

Kazuhiko Ohkawa, Suwa, JP;

Yasuhiro Oguchi, Suwa, JP;

Yasuhisa Hirabayashi, Suwa, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ; H01L / ;
U.S. Cl.
CPC ...
357 45 ; 357 41 ; 437 51 ; 307465 ;
Abstract

A semiconductor device assembly composed of a plurality of unit semiconductor devices formed into a logic circuit by selective connection among elements in the unit devices and among the unit devices. Each of the unit devices includes at least a first insulated-gate type field-effect transistor of a first conductivity type and a second insulated-gate type field-effect transistor of a second conductivity type which is disposed adjacent to the first transistor and has a gate electrode separated from a gate electrode of the first transistor. The gate electrodes of the respective transistors have at least a gate terminal portion at the side adjacent to each other, and the gate terminal portion of the first field-effect transistor has at least a first wire connecting location and a second wire connecting location. By using the second wire connecting location, wiring in and among the unit devices can be carried out via the shortest aluminum wires of a first layer, so that the wiring feasibility can be enhanced.


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