The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 04, 1992
Filed:
Mar. 25, 1991
Abstract
An integrated circuit package having enhanced mounting density is provided. The package includes a microwave integrated circuit and a drive circuit therefor, both accommodated in a casing having a layer structure made of a multi-layer ceramic. Through holes in a multi-layer ceramic are utilized for wiring so that the number of conductive tracks provided on the same plane can be reduced and the mounting density can be enhanced. The integrated circuit and the drive circuit are disposed in the casing vertically with respect to each other to reduce the overall longitudinal dimension of the package and enhance mounting density. High frequency connectors adapted to feed high frequency signals to the integrated circuit, and connector pins adapted to supply external control signals and a power signal to the drive circuit, are connected on the underside surface of the casing. A through hole of a horse shoe type is formed through one of the dielectric members, and metallic material is filled therein to provide an external conductor for coaxial tracks. Alternatively, this through hole can be processed by plating or the like to improve the electrical characteristics.