The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 04, 1992

Filed:

Dec. 07, 1990
Applicant:
Inventors:

Tomoaki Kato, Sagamihara, JP;

Tetsuo Yoshizawa, Yokohama, JP;

Toyohide Miyazaki, Ibaraki, JP;

Hiroshi Kondo, Osaka, JP;

Takashi Sakaki, Tokyo, JP;

Yoshimi Terayama, Odawara, JP;

Yoichi Tamura, Tokyo, JP;

Takahiro Okabayashi, Tokyo, JP;

Kazuo Kondo, Tokyo, JP;

Yasuo Nakatsuka, Tokyo, JP;

Yuichi Ikegami, Osaka, JP;

Assignees:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23F / ; B44C / ; B29C / ;
U.S. Cl.
CPC ...
156631 ; 29876 ; 156634 ; 156644 ; 156656 ; 1566591 ; 1566611 ; 156668 ; 156902 ; 205135 ;
Abstract

A process for preparing an electrical connecting member having a holding member with an electrically insulating material, and a plurality of electroconductive members. The electroconductive members are mutually insulated from each other and one end of each of the electroconductive members is exposed at one surface of the holding member and the other end is exposed at another surface of the holding member. A holding member is formed by forming a layer on a base member with the holding member having a photosensitive resin on the uppermost surface of the layer. The holding member is exposed and developed by forming a plurality of holes through the holding member, thereby exposing the uppermost surface of the layer. A part of the exposed layer is etched away and the holes on the holding member are filled with an electroconductive member. The remaining layer and base member are then removed.


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