The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 28, 1992
Filed:
Dec. 06, 1990
Akira Yamakawa, Hyogo, JP;
Akira Sasame, Hyogo, JP;
Sumitomo Electric Industries, Ltd., Osaka, JP;
Abstract
A ceramic substrate has a surface structure capable of suppressing diffusion of Ni into an Au plating layer by providing an NiAu alloy layer between the substrate and the Au plating layer, whereby the thickness of the Au plating layer may be reduced. Such a surface structure is formed by applying the following layers to the substrate, a metallized layer (12), Ni an layer (13) and Au layer (14) in this order. The substrate (11) is heated in a non-oxidizing atmosphere to cause an alloying reaction between the Ni layer (13) and the Au layer (14). Thereafter, an Au plating layer (16) is formed on the NiAu alloy layer (15). Since Ni in the NiAu alloy layer is not easily released, diffusion of Ni into the Au plating layer is suppressed sufficiently.