The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 28, 1992

Filed:

May. 28, 1991
Applicant:
Inventors:

Matti Sepling, Rajamaki, FI;

Jorma Vuojolainen, Hollola, FI;

Matti Kahilahti, Lahti, FI;

Assignee:

Kone Oy, Helsinki, FI;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B02C / ;
U.S. Cl.
CPC ...
241 78 ; 209 441 ; 209234 ; 209935 ; 241 80 ; 241 81 ; 241 28 ;
Abstract

A two-stage procedure is disclosed for sorting wood chips. The chips are directed to a gyratory screen in the first stage and to a disc screen in the second stage. The chip flow is divided in the first stage into four fractions of which the first fraction contains mainly oversized chips and is directed to a pin chipper, from which it emerges as suitable-sized chips and is directed back to the gyratory screen of the first stage. The second fraction contains acceptable sized chips and most of the overthick chips and is directed to the second or thickness screening stage. The third fraction consists mainly of acceptable chips and is directed to a pulping process, while the fourth fraction consists mainly of fine particles and is directed to a burning station. In the second or thickness screening stage the chip flow is divided into two fractions of which the rougher fraction comprises overthick chips and is directed via a rock and metal separating device into a slicing machine and then back to the first stage gyratory screen, while the finer fraction comprises acceptable chips and is passed directly to the pulping process.


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