The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 14, 1992
Filed:
Nov. 23, 1990
Applicant:
Inventors:
Shuzo Saeki, Yokohama, JP;
Makoto Hideshima, Tokyo, JP;
Assignee:
Kabushiki Kaisha Toshiba, Kawasaki, JP;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ; H01L / ; H01L / ; H01L / ;
U.S. Cl.
CPC ...
357 79 ; 357 46 ;
Abstract
A semiconductor device includes a metallic electrode formed on a semiconductor substrate, and a metallic terminal formed on a metal base through an insulating material, in parallel to the metal electrode. A metallic wire electrically connects the metallic electrode to the metallic terminal. In a metallic conductor having a current capacity larger than that of the metallic wire, one end is in contact with the metallic terminal, and the other end is in contact with the metallic electrode.