The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 14, 1992

Filed:

Jan. 18, 1991
Applicant:
Inventors:

Tzong-Ming Lee, Tainan City, TW;

Ker-Ming Chen, Hsinchu City, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08G / ; C08G / ;
U.S. Cl.
CPC ...
528 93 ; 528 89 ; 528117 ; 528118 ; 525523 ; 525526 ;
Abstract

A modified epoxy resin composition for use in making a printed circuit board comprising: (1) a modified epoxy resin obtained by reacting (a) a low molecular weight epoxy resin having at least two epoxy groups which has the following formula, ##STR1## (b) an N-heterocyclic fatty amino chain-extending agent at least two active hydrogen atoms and represented by the formulas, ##STR2## and (c) at least one catalyst for catalyzing the reaction between components (a) and (b).


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