The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 14, 1992

Filed:

Nov. 15, 1990
Applicant:
Inventors:

Seiichirou Takabayashi, Hirakata, JP;

Kazuaki Mii, Ube, JP;

Kenichiro Yano, Ube, JP;

Assignee:

Ube Industries, Ltd., Yamaguchi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B / ;
U.S. Cl.
CPC ...
428332 ; 427209 ; 427250 ; 427304 ; 427306 ; 427316 ; 4273831 ; 427404 ; 4274431 ; 428458 ;
Abstract

A process for preparing a metallized polyimide film, comprising the steps of: forming a solidified film containing 100 parts by weight of an aromatic polyamic acid in the form of a solution obtained by polymerizing approximately equal moles of an aromatic tetracarboxylic acid component and an aromatic diamine component and 5 to 150 parts by weight of an organic polar solvent; applying a surface treatment solution containing a heat-resistant surface treating agent to the surface of the solidified film; heating the solidified film to a high temperature to imidize the polyamic acid, while drying the film to prepare a polyimide film; forming a thin metal vapor-deposited layer by a vapor deposition of a metal on the treated surface of the polyimide film with the heat-resistant surface treatment agent; and applying metal plating onto the metal vapor deposited layer to form a metal plated layer thereon.


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