The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 07, 1992
Filed:
Jul. 31, 1986
Applicant:
Inventors:
Yoichi Tamaki, Kokubunji, JP;
Tokuo Kure, Kokubunji, JP;
Akira Sato, Hachioji, JP;
Hisayuki Higuchi, Kokubunji, JP;
Assignee:
Hitachi, Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
357 50 ; 357 60 ;
Abstract
A semiconductor device and the method of manufacturing the same are disclosed, the semiconductor device having a plurality of elements isolated by a groove having a gentle slope at the upper side wall, and a steep slope at the lower side wall. This groove provides low steps on its mouth and occupies a small area on the substrate, thus enabling an extremely high-density integrated circuit to be formed.
Tamaki, Yoichi. (1992). Semiconductor device and method of manufacturing the same (U.S. Patent No. 5128743). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5128743
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile