The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 07, 1992
Filed:
Apr. 10, 1991
Applicant:
Inventors:
Pei C Chen, Endicott, NY (US);
Richard D Weale, Owego, NY (US);
Assignee:
International Business Machines Corporation, Armonk, NY (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C / ;
U.S. Cl.
CPC ...
20419215 ;
Abstract
Disclosed is a method of fabricating a microelectronic package having least one layer formed of a copper surface core, e.g., a copper-Invar-copper core, with a polymeric dielectric film. The method includes removing copper oxide from the copper surface of the metallic core or layer. After this step an adhesion layer, such as a chromium layer, a nickel layer, or chromium and nickel or chromium and copper bilayers, is sputter deposited onto the copper surface of metallic core or layer. A polymeric dielectric film is then applied atop the metallic adhesion layer.