The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 07, 1992
Filed:
Jun. 28, 1990
Richard R Steitz, Chippewa Falls, WI (US);
Melvin C August, Chippewa Falls, WI (US);
Diane M Christie, Eau Claire, WI (US);
Deanna M Dowdle, Northfield, MN (US);
Dean B Dudley, Prior Lake, MN (US);
Stephen E Nelson, Chippewa Falls, WI (US);
Eugene F Neumann, Chippewa Falls, WI (US);
Paul E Schroeder, Chippewa Falls, WI (US);
Cray Research, Inc., Eagan, MN (US);
Abstract
A flexible automated bonding apparatus electrically interconnects integrated circuit carriers, printed circuit boards, and other devices. A metallized interconnect pattern is deposited on the surface of the substrate. The metallized interconnects in the pattern span apertures created in the substrate using an excimer laser. Thus, the metallized interconnects can be electrically bonded through the apertures to elements lying underneath the substrate.