The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 30, 1992
Filed:
Jun. 19, 1991
Douglas W Wilda, Ambler, PA (US);
Charles E Lane, III, Meadowbrook, PA (US);
Honeywell Inc., Minneapolis, MN (US);
Abstract
A pressure sensor package, having a dual-in-line package (DIP) structure as commonly used in the semiconductor industry, comprises a first layer of predetermined material, having at least one internal passage for transmitting a fluid under pressure from a first surface of the first layer to a second surface of the first layer. A pressure sensitive element is bonded to the first surface of the first layer, and covers an exit from the first surface of the internal passage. A lead package, has a plurality of pins, each pin being perpendicular to the first surface of the first layer and placed along a first and second length of the first layer exterior to the pressure sensor package, and having a spacing conforming to the DIP configuration. Predetermined points of the pressure sensitive element are electrically connected to predetermined pins. A second layer of predetermined material is bonded to the first surface of the first layer providing an enclosed spaced for the pressure sensitive element.