The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 23, 1992
Filed:
May. 25, 1990
Hironari Sano, Yokkaichi, JP;
Hideaki Nakagawa, Yokkaichi, JP;
Kenichi Tange, Okazaki, JP;
Yoshinori Yamamori, Okazaki, JP;
Mitsubishi Petrochemical Company Limited, Tokyo, JP;
Mitsubishi Jidosha Kogyo, Tokyo, JP;
Abstract
An injection-molded product comprising: component A: 45 to 70% by weight of a propylene polymer 2.16 kg) of 10 to 100 g/10 min and an ethylene content of 0 to 15% by weight; and component B: 30 to 55% by weight of an ethylene/propylene copolymer-based rubber having a melt flow rate (at 230.degree. C. under a load of 5 kg) of 0.5 to 20 g/10 min and a propylene content of 20 to 40% by weight; the ratio MFR.sub.A /MFR.sub.B of the melt flow rate (MFR.sub.A) of component A to the melt flow rate (MFR.sub.B) of component B being 0.5 to 50, and the molded product having such physical properties as expressed in terms of a modulus in flexure of 2,000 to 5,000 kg/cm.sup.2, as determined according to JIS-K7203 and a coefficient of linear expansion of 10 .times.10.sup.-5 /.degree. C. or below, as determined according to ASTM-D696, and having an average thickness of 2 to 7 mm.