The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 23, 1992
Filed:
Jun. 11, 1990
Applicant:
Inventors:
Nanao Horiishi, Hiroshima, JP;
Kotaro Hirayama, Kanagawa, JP;
Masanori Terasaki, Kanagawa, JP;
Tetsuro Toda, Hiroshima, JP;
Shigeru Takaragi, Hiroshima, JP;
Assignees:
Toda Kogyo Corporation, Hiroshima, JP;
Dai-ichi High Frequency Company Limited, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B / ;
U.S. Cl.
CPC ...
1562724 ; 252 6256 ; 219 1041 ;
Abstract
Disclosed herein is a method for bonding a resin part, which comprises disposing a magnetic complex composed of a resin and magnetic particles as a heating-medium at the resin parts to be bonded, and applying an alternating magnetic field to the heating-medium by using a magnetic field generating means composed of an electromagnetic core and an exciting coil, thereby making said heating-medium generate heat for fuse-bonding said resins.